Manufacture of ceramic multi-layer wiring circuit substrate

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Cited By (4)

    Publication numberPublication dateAssigneeTitle
    JP-H01104729-UJuly 14, 1989
    JP-H0369197-B2October 31, 1991Matsushita Electric Ind Co Ltd
    JP-S6247196-AFebruary 28, 1987Matsushita Electric Ind Co LtdCeramic multilayer substrate
    US-5669136-ASeptember 23, 1997International Business Machines CorporationMethod of making high input/output density MLC flat pack